The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Sep. 26, 2007
Osamu Okada, Yokohama, JP;
Toshiki Takizawa, Yokohama, JP;
Naruhiko Mashita, Yokohama, JP;
Takashi Ishiguro, Taito-ku, JP;
Shinya Kusumi, Taito-ku, JP;
Hiroshi Tsutagaya, Taito-ku, JP;
Osamu Okada, Yokohama, JP;
Toshiki Takizawa, Yokohama, JP;
Naruhiko Mashita, Yokohama, JP;
Takashi Ishiguro, Taito-ku, JP;
Shinya Kusumi, Taito-ku, JP;
Hiroshi Tsutagaya, Taito-ku, JP;
Bridgestone Corporation, Tokyo, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
A radio wave absorber that can be bonded securely to a flexible cable or a flexible printed circuit board eliminates the need for a release film. A radio wave absorber comprising a thermosetting adhesive sheetthat is cured into a flexible material, and a Sendust-containing curable resin composition layerthat is cured into a flexible material, wherein the curable resin composition layer is formed on either surface of the thermosetting adhesive sheet. The average particle diameter of Sendust is in the range of 30 to 100 μm. The content ratio of Sendust in the curable resin composition layer is in the range of 50 to 85 wt %.