The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Feb. 13, 2007
Marco Lederer, Nürnberg, DE;
Rainer Popp, Petersaurach, DE;
Marco Lederer, Nürnberg, DE;
Rainer Popp, Petersaurach, DE;
SEMIKRON Elektronik GmbH & Co. KG, Nürnberg, DE;
Abstract
A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion and having a plurality of contact feet extending from the flat portion. Each flat portion of the load terminal is disposed parallel to, and spaced from, the substrate. The contact feet also extend from the flat portion to the substrate, where they form the contacts of the terminal elements. A molded insulation body is disposed between the flat portions of the load terminals and the substrate, and this molded insulation body has recesses for permitting the passage therethrough of the contact feet.