The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2009

Filed:

May. 24, 2006
Applicants:

Hajime Kuwajima, Tokyo, JP;

Masashi Gotoh, Tokyo, JP;

Inventors:

Hajime Kuwajima, Tokyo, JP;

Masashi Gotoh, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

To fill a conductive material in an opening portion formed in a base of an electronic component, a groove is formed to surround an opening in an upper conductor, and the upper conductor is divided into a first conductive portion and a second conductive portion surrounding the first conductive portion. A mask is formed such that a conductor to be filled in the opening portion may not contact the second conductive portion. Metal plate is grown from the side of a lower conductor in the opening portion by using the lower conductor as electrode to fill the opening portion with metal plate. The metal plate filled in the opening portion and the upper conductor are joined by plating by using the upper conductor or the lower conductor as electrode.


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