The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
May. 19, 2004
Applicants:
Yuichi Kawata, Yawata, JP;
Naoko Tanaka, Neyagawa, JP;
Inventors:
Yuichi Kawata, Yawata, JP;
Naoko Tanaka, Neyagawa, JP;
Assignee:
Nippon Shokubai Co., Ltd., Osaka-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention is characterized by a resin composition for a thermal conductive material including a polymer (I), a liquid-state plasticizer (II) and a thermal conductive filler (III) having a thermal conductivity of 20 W/m·K or more, wherein the liquid-state plasticizer (II) is in a liquid state at 25° C., and has a mass loss rate of 2 mass % or less when kept at 130° C. for 24 hours. By using this resin composition for a thermal conductive material, it becomes possible to obtain a thermal conductive material having superior thermal conductivity and flexibility.