The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Sep. 04, 2008
Masaya Tajima, Aichi, JP;
Katsuya Kogiso, Aichi, JP;
Mitsuo Watanabe, Aichi, JP;
Toshiki Matsubara, Aichi, JP;
Kenji Sato, Aichi, JP;
Masaya Tajima, Aichi, JP;
Katsuya Kogiso, Aichi, JP;
Mitsuo Watanabe, Aichi, JP;
Toshiki Matsubara, Aichi, JP;
Kenji Sato, Aichi, JP;
Abstract
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The surface of the package is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the package and housing in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the device is easily produced by insert molding and has excellent moisture resistance.