The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2009
Filed:
Mar. 10, 2006
Tomoaki Yamashita, Oyama, JP;
Yasuo Inoue, Chikusei, JP;
Masaharu Matsuura, Yuuki, JP;
Toyoki Ito, Chikusei, JP;
Akira Shimizu, Yuuki, JP;
Fumio Inoue, Tsukuba, JP;
Akishi Nakaso, Oyama, JP;
Tomoaki Yamashita, Oyama, JP;
Yasuo Inoue, Chikusei, JP;
Masaharu Matsuura, Yuuki, JP;
Toyoki Ito, Chikusei, JP;
Akira Shimizu, Yuuki, JP;
Fumio Inoue, Tsukuba, JP;
Akishi Nakaso, Oyama, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.