The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Nov. 08, 2005
Yung-yu Chiu, Taoyuan Hsien, TW;
Te-tsai Chuang, Taoyuan Hsien, TW;
Kuo-cheng Lin, Taoyuan Hsien, TW;
Wen-shi Huang, Taoyuan Hsien, TW;
Yung-Yu Chiu, Taoyuan Hsien, TW;
Te-Tsai Chuang, Taoyuan Hsien, TW;
Kuo-Cheng Lin, Taoyuan Hsien, TW;
Wen-Shi Huang, Taoyuan Hsien, TW;
Delta Electronics Inc., Taoyuan Hsien, TW;
Abstract
A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.