The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2009

Filed:

Aug. 26, 2005
Applicants:

Satoshi Yamauchi, Anjo, JP;

Akihiro Mizutani, Nagoya, JP;

Inventors:

Satoshi Yamauchi, Anjo, JP;

Akihiro Mizutani, Nagoya, JP;

Assignee:

Denso Corporation, Kariya, Aichi-Pref., JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board mounting electronic components including a heat generating element is accommodated in a casing. A heat dissipation member is disposed between the heat generating element and an inner surface of the casing. The heat dissipation member is thermally bonded to the heat generating element and to the casing. The heat dissipation member is a polymeric material having fluidity. A film for preventing a shifting of the heat dissipation member is disposed between the heat dissipation member and the casing. And, the film is chemically or electrically bonded to the heat dissipation member and to the casing.


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