The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Oct. 23, 2006
Kyoung Woo Lee, Fishkill, NY (US);
Ja Hum Ku, Seongnam-si, KR;
Ki Chul Park, Suwon-si, KR;
Seung Man Choi, Fishkill, NY (US);
Kyoung Woo Lee, Fishkill, NY (US);
Ja Hum Ku, Seongnam-si, KR;
Ki Chul Park, Suwon-si, KR;
Seung Man Choi, Fishkill, NY (US);
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A semiconductor wafer having multi-layer metallization structures that are fabricated to include embedded interconnection structures which serve as low-resistance electroplating current paths to conduct bulk electroplating current fed to portions of a metallic seed layer at peripheral surface regions of the wafer to portions of the metallic seed layer at inner/central surface regions of the semiconductor wafer to achieve uniformity in metal plating in chip regions across the wafer.