The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Dec. 05, 2003
Applicant:
Kang-hyun Lee, Yongin, KR;
Inventor:
Kang-Hyun Lee, Yongin, KR;
Assignee:
Dongbu Electroncis Co., Ltd., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention is directed to a method for fabricating a metal line of a semiconductor device. The method comprises the steps of forming an insulation layer, a metal layer and an organic anti-reflection coating in order on a semiconductor substrate on which devices or lower lines are formed, forming a photoresist pattern having an opening of certain width on the organic anti-reflection coating, forming a buffer layer of certain thickness on the photoresist pattern, and selectively removing the metal layer at a lower side of the opening by performing a dry etching process.