The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Feb. 14, 2005
Michael Dankert, Offenbach, DE;
Martin Feldhege, Saarlouis, DE;
Stefan Irmisch, Jupiter, FL (US);
Matthias Oechsner, Mülheim an der Ruhr, DE;
Eckart Schumann, Mülheim an der Ruhr, DE;
Werner Stamm, Mülheim an der Ruhr, DE;
Michael Dankert, Offenbach, DE;
Martin Feldhege, Saarlouis, DE;
Stefan Irmisch, Jupiter, FL (US);
Matthias Oechsner, Mülheim an der Ruhr, DE;
Eckart Schumann, Mülheim an der Ruhr, DE;
Werner Stamm, Mülheim an der Ruhr, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
Method for recording microstructural changes in a layer system component. A specific material parameter of the component is measured. The layer system may include an alloy substrate and an alloy or porous ceramic layer. The material parameter may be measured a plurality of times. The measured material parameter may include electrical capacitance, specific heat capacity, peltier coefficient or magnetic susceptibility. The material parameter may first be measured on a new component and subsequent measurements may be performed at a time interval after operational use. The recorded material parameter is then used to determine microstructural changes in the substrate or the layer material of the component caused by changes in precipitation, cracks, or depletion of an alloying element.