The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Mar. 27, 2007
Takehito Tsukamoto, Tokyo, JP;
Hiroshi Matsuzawa, Tokyo, JP;
Satoshi Akimoto, Tokyo, JP;
Masataka Maehara, Tokyo, JP;
Takumi Suemoto, Tokyo, JP;
Masayuki Ode, Tokyo, JP;
Yuichi Sakaki, Tokyo, JP;
Takehito Tsukamoto, Tokyo, JP;
Hiroshi Matsuzawa, Tokyo, JP;
Satoshi Akimoto, Tokyo, JP;
Masataka Maehara, Tokyo, JP;
Takumi Suemoto, Tokyo, JP;
Masayuki Ode, Tokyo, JP;
Yuichi Sakaki, Tokyo, JP;
Toppan Printing Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.