The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
Mar. 14, 2008
John Dallesasse, Geneva, IL (US);
Joseph Scheibenreif, Oswego, IL (US);
Bryan Noble, Oswego, IL (US);
Thomas Whitehead, Chicago, IL (US);
Paul Wachtel, Arlington Heights, IL (US);
Bogdan Andrei, Lisle, IL (US);
Dean Richardson, Wilmette, IL (US);
Brett Lane, Westmont, IL (US);
Anthony Moretti, Saint Charles, IL (US);
David Mccallum, West Chicago, IL (US);
John Dallesasse, Geneva, IL (US);
Joseph Scheibenreif, Oswego, IL (US);
Bryan Noble, Oswego, IL (US);
Thomas Whitehead, Chicago, IL (US);
Paul Wachtel, Arlington Heights, IL (US);
Bogdan Andrei, Lisle, IL (US);
Dean Richardson, Wilmette, IL (US);
Brett Lane, Westmont, IL (US);
Anthony Moretti, Saint Charles, IL (US);
David McCallum, West Chicago, IL (US);
Emcore Corporation, Albuquerque, NM (US);
Abstract
An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.