The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2009

Filed:

Oct. 14, 2005
Applicants:

James P. Huang, Huntington Beach, CA (US);

Russell M. Abbott, Riverside, CA (US);

David J. Nakamura, La Palma, CA (US);

Leslie A. Momoda, Los Angeles, CA (US);

Kevin J. Rooney, West Hills, CA (US);

Bruce L. Drolen, Altadena, CA (US);

John H. Belk, St. Louis, MO (US);

William Barvosa-carter, Ventura, CA (US);

Brian R. Foy, Cypress, CA (US);

Inventors:

James P. Huang, Huntington Beach, CA (US);

Russell M. Abbott, Riverside, CA (US);

David J. Nakamura, La Palma, CA (US);

Leslie A. Momoda, Los Angeles, CA (US);

Kevin J. Rooney, West Hills, CA (US);

Bruce L. Drolen, Altadena, CA (US);

John H. Belk, St. Louis, MO (US);

William Barvosa-Carter, Ventura, CA (US);

Brian R. Foy, Cypress, CA (US);

Assignee:

The Boeing Company, Chiacgo, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus may have a multilayered support base having a structural section made up of operating components and a function support section. The function support section may have transmission paths and components to supply thermal, power transmission, information and communication paths, along with other functions. At least some of the components may be heat generating and may have a thermal interface surface which may be in operating and heat conductive relationship with a heat conductive substrate/routing section which may have operative connections to the multilayered support base. Some of the components may transmit and receive with one another through the substrate/routing section.


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