The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
Feb. 25, 2005
Yuhsuke Matsumoto, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Tatsushi Yoshida, Chigasaki, JP;
Nobuyuki Hashi, Kanagawa, JP;
Hiroyasu Tsuchida, Kanagawa, JP;
Takuma Muraki, Kanagawa, JP;
Yuhsuke Matsumoto, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Tatsushi Yoshida, Chigasaki, JP;
Nobuyuki Hashi, Kanagawa, JP;
Hiroyasu Tsuchida, Kanagawa, JP;
Takuma Muraki, Kanagawa, JP;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.