The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
Jul. 27, 2006
Applicant:
Tatsuhiko Asakawa, Fujimi-machi, JP;
Inventor:
Tatsuhiko Asakawa, Fujimi-machi, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device including: a semiconductor chip having an electrode; a plurality of resin protrusions formed on a surface of the semiconductor chip on which the electrode is formed, heights of the resin protrusions increasing as a distance from a center of the surface of the semiconductor chip increases; and an interconnect electrically connected to the electrode and formed over one of the resin protrusions.
Asakawa, Tatsuhiko. (2009). Semiconductor device, electronic module, and method of manufacturing electronic module (U.S. Patent No. 7582967). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7582967
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile