The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2009

Filed:

Dec. 21, 2005
Applicants:

Sung Jun Lee, Seoul, KR;

Woong Lin Hwang, Kyungki-do, KR;

Sang Hyun Choi, Seoul, KR;

Chang Hyun Lim, Daegu, KR;

Ho Joon Park, Seoul, KR;

Seog Moon Choi, Seoul, KR;

Inventors:

Sung Jun Lee, Seoul, KR;

Woong Lin Hwang, Kyungki-do, KR;

Sang Hyun Choi, Seoul, KR;

Chang Hyun Lim, Daegu, KR;

Ho Joon Park, Seoul, KR;

Seog Moon Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.


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