The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2009

Filed:

Nov. 22, 2006
Applicants:

Hiroshi Yamamoto, Konan, JP;

Toshitake Seki, Niwa-gun, JP;

Jun Otsuka, Konan, JP;

Manabu Sato, Nagoya, JP;

Masahiko Okuyama, Nagoya, JP;

Inventors:

Hiroshi Yamamoto, Konan, JP;

Toshitake Seki, Niwa-gun, JP;

Jun Otsuka, Konan, JP;

Manabu Sato, Nagoya, JP;

Masahiko Okuyama, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 4/228 (2006.01);
U.S. Cl.
CPC ...
Abstract

A via array capacitor including a capacitor body having a first main surface and a second main surface and having a structure in which dielectric layers and inner electrode layers are alternately laminated; a plurality of via conductors which conduct the inner electrode layers to each other and are, as a whole, arranged in array form; and metal-containing layers which are disposed on at least one of the first main surface and the second main surface, wherein a total volume of the inner electrode layers and the metal-containing layers included in the via array capacitor is from 45 vol.% to 95 vol.% of a volume of the via array capacitor.


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