The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Jul. 17, 2006
Shinya Udo, Kawasaki, JP;
Masao Kumagai, Kawasaki, JP;
Masatoshi Kokubun, Kawasaki, JP;
Hidekazu Nishizawa, Kawasaki, JP;
Takeo Shigihara, Kawasaki, JP;
Shinya Udo, Kawasaki, JP;
Masao Kumagai, Kawasaki, JP;
Masatoshi Kokubun, Kawasaki, JP;
Hidekazu Nishizawa, Kawasaki, JP;
Takeo Shigihara, Kawasaki, JP;
Fujitsu Microelectronics Limited, Tokyo, JP;
Abstract
A semiconductor device carries out a test utilizing contact with a probe needle without being affected by narrowing of the pitch at which output pads are arranged. The device is equipped with test circuits provided between a plurality of output buffers via which signals are output and output pads corresponding thereto. The test circuit includes output switches caused to sequentially make connections by a controller in test and interpad switches involved in making connections of the output pads with a test pad by the controller in test. In test, probe needles are brought into contact with the test pad. The output pads are not used in test, and can be arranged at a narrowed pitch. Thus, the chip area can be reduced and are therefore so that the pitch for the output pads can be narrowed and the chip area can be decreased.