The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Jan. 26, 2004
Atsushi Saito, Takasaki, JP;
Katsuhiro Higuchi, Hitachinaka, JP;
Osamu Otsuka, Atsugi, JP;
Hidekazu Nishidai, Isesaki, JP;
Hiroshi Houzouji, Hitachiohta, JP;
Toshiaki Morita, Hitachi, JP;
Yoshimasa Takahashi, Kyoto, JP;
Toshiya Sato, Hitachiohta, JP;
Atsushi Saito, Takasaki, JP;
Katsuhiro Higuchi, Hitachinaka, JP;
Osamu Otsuka, Atsugi, JP;
Hidekazu Nishidai, Isesaki, JP;
Hiroshi Houzouji, Hitachiohta, JP;
Toshiaki Morita, Hitachi, JP;
Yoshimasa Takahashi, Kyoto, JP;
Toshiya Sato, Hitachiohta, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section and a radiator is provided. The semiconductor device is connected to the cooling system and is cooled. A variation width (ΔT) of temperature controlled by the cooling system through the heating section and the radiator is smaller than a temperature variation (ΔT) of the refrigerant caused by variations in operating conditions of the semiconductor device (ΔT≦ΔT).