The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
May. 24, 2004
Applicant:
Yukihiro Takao, Nitta-machi, JP;
Inventor:
Yukihiro Takao, Nitta-machi, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disconnection and deterioration in step coverage of wirings are prevented to offer a semiconductor device having higher reliability. A pad electrode is formed on a surface of a silicon die. A via hole penetrating the silicon die is formed from a back surface of the silicon die to the pad electrode. A wiring layer disposed on the back surface of the silicon die runs through the via hole and is electrically connected with the pad electrode. The wiring layer covers a convex portion of silicon on the back surface of the silicon die. A solder ball is formed on the wiring layer on the convex portion of silicon.