The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
May. 22, 2006
Applicants:
Kenzo Danjo, Osaka, JP;
Hideo Isii, Osaka, JP;
Masao Katooka, Osaka, JP;
Shuji Yokoyama, Osaka, JP;
Inventors:
Assignee:
Sansha Electric Manufacturing Company Limited, Osaka-Shi, Osaka-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed circuit board () includes an insulating substrate () on which conductive films () are formed. Semiconductor devices () disposed external to the printed circuit board () have their leads () connected to the conductive films. A flexible portion () is formed in the insulating substrate () at a location near the location where the leads () are connected to the conductive films ().