The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Sep. 20, 2005
Hideyasu Matsumura, Shiga, JP;
Tatsuya Matsugashita, Nara, JP;
Hideyasu Matsumura, Shiga, JP;
Tatsuya Matsugashita, Nara, JP;
Sekisui Plastics Co., Ltd., Osaka, JP;
Abstract
An expanded molded article having a void percentage of 5 to 50%, the molded article comprising 50 to 800 parts by weight of styrene-based resin relative to 100 parts by weight of non-crosslinked linear low-density polyethylene-based resin which can be obtained by using a metallocene catalyst, wherein the molded article is obtained by impregnating styrene-modified linear low-density polyethylene-based resin beads with a volatile blowing agent to provide expandable beads, pre-expanding the expandable beads and then subjecting the obtained pre-expanded beads to expansion molding, the styrene-modified linear low-density polyethylene-based resin beads each have the styrene-based resin dispersed in the form of particles, and a diameter of particle is 0.8 μm or smaller in a surface region within at least 5 μm from the bead surface and in a center region within a 5 μm radius from the bead center.