The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Feb. 20, 2007
Kimiharu Kayukawa, Nisshin, JP;
Akira Tanahashi, Okazaki, JP;
Chikage Noritake, Ama-gun, JP;
Shoji Miura, Nukata-gun, JP;
Kimiharu Kayukawa, Nisshin, JP;
Akira Tanahashi, Okazaki, JP;
Chikage Noritake, Ama-gun, JP;
Shoji Miura, Nukata-gun, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base member through the first metal layer, the first alloy layer and the tin-based solder layer in this order. The first alloy layer is made of a first metal in the first metal layer and tin in the tin-based solder layer. The first metal layer is made of at least one of material selected from the group consisting of titanium, aluminum, iron, molybdenum, chromium, vanadium and iron-nickel-chromium alloy.