The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Aug. 22, 2006
Sung-tae Moon, Gyeonggi-do, KR;
Dong-jun Lee, Seoul, KR;
Kyoung-moon Kang, Gyeonggi-do, KR;
Nam-soo Kim, Gyeonggi-do, KR;
Bong-su Ahn, Seoul, KR;
Sung-Tae Moon, Gyeonggi-do, KR;
Dong-Jun Lee, Seoul, KR;
Kyoung-Moon Kang, Gyeonggi-do, KR;
Nam-Soo Kim, Gyeonggi-do, KR;
Bong-Su Ahn, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.