The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Feb. 09, 2006
Hiroyuki Masuko, Chiba, JP;
Yutaka Sato, Chiba, JP;
Hiroyuki Masuko, Chiba, JP;
Yutaka Sato, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
A semiconductor device has power supply pads including a first power supply pad and at least one second power supply pad that are connected to internal power supply wirings through an internal circuit so that the first and second power supply pads are set to the same potential. The first power supply pad is bonded by a wire to a lead to which a supply voltage is applied and is connected to the round power supply wiring through a round power supply connection wiring. A signal pad from which electrostatic noise enters into the semiconductor device is provided. An input protection circuit is connected between the signal pad and the internal circuit and is connected to the round power supply wiring through a protection circuit power supply wiring. The second power supply pad is not bonded by a wire to a lead to which a supply voltage is applied and is not connected to the round power supply wiring so that when electrostatic noise enters the signal pad, the electrostatic noise is discharged to the exterior of the semiconductor device without the electrostatic noise being led to the internal circuit.