The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Apr. 30, 2007
Sachin Kumar, Freeport, IL (US);
James D. Cook, Freeport, IL (US);
Gary O'brien, Riverview, MI (US);
Mohammed a J Qasimi, Freeport, IL (US);
Richard C. Sorenson, Galloway, OH (US);
Brian J. Marsh, Freeport, IL (US);
Viorel V. Avramescu, Bucharest, RO;
Sachin Kumar, Freeport, IL (US);
James D. Cook, Freeport, IL (US);
Gary O'Brien, Riverview, MI (US);
Mohammed A J Qasimi, Freeport, IL (US);
Richard C. Sorenson, Galloway, OH (US);
Brian J. Marsh, Freeport, IL (US);
Viorel V. Avramescu, Bucharest, RO;
Honeywell International Inc., Morristown, NJ (US);
Abstract
A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.