The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Jan. 31, 2007
Shyh-ming Chang, Hsinchu, TW;
Sheng-shu Yang, Hsinchu, TW;
Shyh-Ming Chang, Hsinchu, TW;
Sheng-Shu Yang, Hsinchu, TW;
Taiwan TFT LCD Association, Hsinchu, TW;
Chunghwa Picture Tubes, Ltd., Taoyuan, TW;
Au Optronics Corporation, Hsinchu, TW;
Hannstar Display Corporation, Taipei, TW;
Chi Mei Optoelectronics Corporation, Tainan County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
TPO Dispalys Corp., Miao-Li County, TW;
Abstract
A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.