The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Sep. 10, 2004
Applicant:
Masashi Horimoto, Kyoto, JP;
Inventor:
Masashi Horimoto, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has an IC chip main body including a power transistor and a substrate of BGA type including an insulating substrate. A plurality of external electrodes are formed on a plurality of through holes formed in the insulating substrate so as to individually penetrate from one surface to the other surface and protrude to the other surface. Further, the external electrodes are arranged in a grid pattern. Power pads among IC pads of the IC chip main body are bonded to substrate pads connected to outermost peripheral external electrodes among the external electrodes of the substrate, such that the lengths of the wires become shorter.