The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Nov. 11, 2008
Brian D. Chapman, Poughkeepsie, NY (US);
Mary A. Emmett, Poughkeepsie, NY (US);
Arden S. Lake, Poughkeepsie, NY (US);
Wai Mon WA, Poughkeepsie, NY (US);
Nandu N. Ranadive, Wappingers Falls, NY (US);
Michael Variano, Huntersville, NC (US);
John P. Weir, Lagrangeville, NY (US);
Brian D. Chapman, Poughkeepsie, NY (US);
Mary A. Emmett, Poughkeepsie, NY (US);
Arden S. Lake, Poughkeepsie, NY (US);
Wai Mon Wa, Poughkeepsie, NY (US);
Nandu N. Ranadive, Wappingers Falls, NY (US);
Michael Variano, Huntersville, NC (US);
John P. Weir, Lagrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.