The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Oct. 09, 2007
Dwadasi Hare Rama Sarma, Kokomo, IN (US);
Rhonda Jean Heytens, Kokomo, IN (US);
Carl William Berlin, West Lafayette, IN (US);
Manuel Ray Fairchild, Kokomo, IN (US);
Bruce Alan Myers, Kokomo, IN (US);
Daniel Keith Ward, Kokomo, IN (US);
Dwadasi Hare Rama Sarma, Kokomo, IN (US);
Rhonda Jean Heytens, Kokomo, IN (US);
Carl William Berlin, West Lafayette, IN (US);
Manuel Ray Fairchild, Kokomo, IN (US);
Bruce Alan Myers, Kokomo, IN (US);
Daniel Keith Ward, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-nonconductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.