The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
May. 10, 2005
Satoru Araki, San Jose, CA (US);
Robert Stanley Beach, Los Gatos, CA (US);
Marie-claire Cyrille, San Jose, CA (US);
Wipul Pemsiri Jayasekara, Los Gatos, CA (US);
Quang Le, San Jose, CA (US);
Jui-lung LI, San Jose, CA (US);
David John Seagle, Morgan Hill, CA (US);
Howard Gordon Zolla, San Jose, CA (US);
Satoru Araki, San Jose, CA (US);
Robert Stanley Beach, Los Gatos, CA (US);
Marie-Claire Cyrille, San Jose, CA (US);
Wipul Pemsiri Jayasekara, Los Gatos, CA (US);
Quang Le, San Jose, CA (US);
Jui-Lung Li, San Jose, CA (US);
David John Seagle, Morgan Hill, CA (US);
Howard Gordon Zolla, San Jose, CA (US);
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.