The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2009

Filed:

Sep. 07, 2006
Applicants:

Carl L. Eggerding, Murrells Inlet, SC (US);

Jason Macneal, Danville, KY (US);

John L. Galvagni, Surfside Beach, SC (US);

Andrew P. Ritter, Surfside Beach, SC (US);

Inventors:

Carl L. Eggerding, Murrells Inlet, SC (US);

Jason MacNeal, Danville, KY (US);

John L. Galvagni, Surfside Beach, SC (US);

Andrew P. Ritter, Surfside Beach, SC (US);

Assignee:

AVX Corporation, Myrtle Beach, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. First and second transition layer electrode portions are provided on a top surface of the multilayered arrangement on top of which a cover layer formed to define openings, or windows, therein is provided. The cover layer may be provided before device firing or may be printed on after firing using polymer or glass. Peripheral terminations are subsequently formed on the device periphery to connect selected electrode layers to respective transition layer electrode portions. Via terminations are formed in the cover layer openings, on top of which solder balls may be applied. Some of the terminations may be formed in accordance with various plating techniques as disclosed.


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