The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2009
Filed:
Jul. 20, 2006
June Cline, South Burlington, VT (US);
Dinh Dang, Essex Junction, VT (US);
Mark Lagerquist, Colchester, VT (US);
Jeffrey C. Maling, Grand Isle, VT (US);
Lisa Y. Ninomiya, Ridgefield, CT (US);
Bruce W. Porth, Jericho, VT (US);
Steven M. Shank, Jericho, VT (US);
Jessica A. Trapasso, Essex Junction, VT (US);
June Cline, South Burlington, VT (US);
Dinh Dang, Essex Junction, VT (US);
Mark Lagerquist, Colchester, VT (US);
Jeffrey C. Maling, Grand Isle, VT (US);
Lisa Y. Ninomiya, Ridgefield, CT (US);
Bruce W. Porth, Jericho, VT (US);
Steven M. Shank, Jericho, VT (US);
Jessica A. Trapasso, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure. The structure includes (a) a semiconductor substrate; (b) a hard mask layer on top of the semiconductor substrate; and (c) a hard mask layer opening in the hard mask layer. The semiconductor substrate is exposed to the atmosphere through the hard mask layer opening. The hard mask layer opening comprises a top portion and a bottom portion, wherein the bottom portion is disposed between the top portion and the semiconductor substrate. The bottom portion has a greater lateral width than the top portion.