The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7572729 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 11, 2009

Filed:

Dec. 08, 2006
Applicant:

IL Young Kwon, Seoul, KR;

Inventor:

Il Young Kwon, Seoul, KR;

Assignee:

Hynix Semiconductor Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing semiconductor devices, including the steps of forming an insulating layer on a semiconductor substrate in which predetermined structures are formed, and etching the insulating layer to expose a predetermined region of the semiconductor substrate, thereby forming a contact hole, forming an insulating layer on the sides of the contact hole, and forming a conductive layer within the contact hole, forming a contact plug. It is possible to prevent a short problem by sufficiently securing a distance between a drain contact plug and a virtual power line.


Find Patent Forward Citations

Kwon, Il. (2009). Method of manufacturing semiconductor device (U.S. Patent No. 7572729). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7572729

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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