The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2009

Filed:

Jan. 26, 2005
Applicants:

Zvonimir Z. Bandic, San Jose, CA (US);

A. David Erpelding, San Jose, CA (US);

Jordan Asher Katine, San Jose, CA (US);

Quang Le, San Jose, CA (US);

Kim Y. Lee, Fremont, CA (US);

Jui-lung LI, San Jose, CA (US);

Michael J. Rooks, Briarcliff Manor, NY (US);

Inventors:

Zvonimir Z. Bandic, San Jose, CA (US);

A. David Erpelding, San Jose, CA (US);

Jordan Asher Katine, San Jose, CA (US);

Quang Le, San Jose, CA (US);

Kim Y. Lee, Fremont, CA (US);

Jui-Lung Li, San Jose, CA (US);

Michael J. Rooks, Briarcliff Manor, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 5/64 (2006.01); G11B 5/66 (2006.01); G11B 5/65 (2006.01); G11B 5/86 (2006.01);
U.S. Cl.
CPC ...
Abstract

A contact magnetic transfer (CMT) master template has a flexible plastic film with a planarized top or upper surface containing magnetic islands separated from one another by nonmagnetic regions. The flexible plastic film is secured at its perimeter to a silicon annulus that provides rigid support at the perimeter of the film. The plastic film is preferably polyimide that has recesses filled with the magnetic material that form the pattern of magnetic islands. The upper surfaces of the islands and the upper surfaces of the nonmagnetic regions form a continuous planar surface. The nonmagnetic regions are formed of chemical-mechanical-polishing (CMP) stop layer material that remains after a CMP process has planarized the upper surface of the plastic film.


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