The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2009
Filed:
Mar. 30, 2006
Akira Matsuzawa, Nagano-ken, JP;
Mutsuhiko Ota, Nagano-ken, JP;
Akira Matsuzawa, Nagano-ken, JP;
Mutsuhiko Ota, Nagano-ken, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
Included are the steps of: forming piezoelectric elements on a surface of a passage-forming substrate with a vibration plate in between, and forming a penetrating portion by removing an area in the vibration plate, which area will serve as a communicating portion; forming lead electrodes and sealing up the penetrating portion with an interconnect layer; joining a reservoir forming plate to a surface of a passage-forming substrate; forming liquid passages by wet-etching; forming protection films on inner surfaces of the liquid passages; detaching and removing a protection film on an interconnect layer; and causing a reservoir portion and a communicating portion to communicate with each other by removing a corresponding part of the interconnect layer, and in accordance with the manufacturing method, while the liquid passages are being formed, the communicating portion is formed in a way that an edge of an opening of the vibration plate is located outside an edge of an opening which is close to the penetrating portion, and in a way that at least the edge of the opening of the penetrating portion is thus configured of only any one of the vibration plate and the interconnect layer.