The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7571061 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 04, 2009

Filed:

Mar. 28, 2008
Applicant:

Zhiyong Cai, Madison, WI (US);

Inventor:

Zhiyong Cai, Madison, WI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01); G01B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The teachings provided herein are generally directed to a non-destructive method of measuring a moisture content profile across a dimension of a hygroexpansive, composite material using radiation and a volumetric shrinkage correction. The measurement of a series of moisture content profiles over time can provide, for example, a measure of the movement of moisture during the process of drying of the composite material.


Find Patent Forward Citations

Cai, Zhiyong. (2009). Non-destructive method of measuring a moisture content profile across a hygroexpansive, composite material (U.S. Patent No. 7571061). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7571061

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