The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Aug. 31, 2005
Gamal Refai-ahmed, Markham, CA;
Robert Wiley, Topsfield, MA (US);
Steven Chan, Richmond Hill, CA (US);
Nima Osqueizadeh, Richmond, CA (US);
Salim Lakhani, Toronto, CA;
Gamal Refai-Ahmed, Markham, CA;
Robert Wiley, Topsfield, MA (US);
Steven Chan, Richmond Hill, CA (US);
Nima Osqueizadeh, Richmond, CA (US);
Salim Lakhani, Toronto, CA;
ATI Technologies ULC, Markham, Ontario, CA;
Abstract
A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.