The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Sep. 02, 2005
Applicants:
Mark Kintis, Manhattan Beach, CA (US);
Flavia S. Fong, Monterey Park, CA (US);
Xing Lan, La Palma, CA (US);
Inventors:
Mark Kintis, Manhattan Beach, CA (US);
Flavia S. Fong, Monterey Park, CA (US);
Xing Lan, La Palma, CA (US);
Assignee:
Northrop Grumman Corporation, Los Angeles, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.