The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2009

Filed:

Jul. 30, 2007
Applicants:

Masamitsu Inaba, Hitachi, JP;

Katsunori Azuma, Hitachi, JP;

Mutsuhiro Mori, Mito, JP;

Kinya Nakatsu, Hitachinaka, JP;

Inventors:

Masamitsu Inaba, Hitachi, JP;

Katsunori Azuma, Hitachi, JP;

Mutsuhiro Mori, Mito, JP;

Kinya Nakatsu, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 1/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a power module, power converter, and vehicular electric machine system capable of reducing inductance of a peripheral section of an output terminal in a power module, and additionally, reducing a surge voltage. A positive emitter conductorconnected to an emitter electrode of a positive power semiconductor element Mpu and an output terminal U are electrically interconnected by using a plurality of aluminum wires, a negative collector conductorconnected to a collector electrode of a negative power semiconductor element Mnu and the output terminal U are electrically interconnected by using a plurality of aluminum wires, and the positive emitter conductorconnected to the emitter electrode of the positive power semiconductor element Mpu and the negative collector conductorconnected to the collector electrode of the negative power semiconductor element Mnu are further electrically interconnected by using a plurality of aluminum wires


Find Patent Forward Citations

Loading…