The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
May. 21, 2008
Shogo Mori, Kariya, JP;
Keiji Toh, Kariya, JP;
Shinobu Tamura, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Shogo Mori, Kariya, JP;
Keiji Toh, Kariya, JP;
Shinobu Tamura, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya-shi, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.