The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Aug. 08, 2007
Applicant:
Yoshiharu Ogata, Sakata, JP;
Inventor:
Yoshiharu Ogata, Sakata, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic shielding plate inserted between the first semiconductor chip and the second semiconductor chip; and a bonding wire bonded on the substrate so as to be astride of the electromagnetic shielding plate.
Ogata, Yoshiharu. (2009). Semiconductor device having a bonding wire and method for manufacturing the same (U.S. Patent No. 7569922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7569922
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile