The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7569907 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 04, 2009

Filed:

Mar. 28, 2005
Applicant:

Vernon Raymond Spaunhorst, Washington, MO (US);

Inventor:

Vernon Raymond Spaunhorst, Washington, MO (US);

Assignee:

Cooper Technologies Company, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.


Find Patent Forward Citations

Spaunhorst, Vernon. (2009). Hybrid chip fuse assembly having wire leads and fabrication method therefor (U.S. Patent No. 7569907). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7569907

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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