The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Feb. 06, 2007
Mitsuyoshi Mori, Kyoto, JP;
Keisuke Tanaka, Osaka, JP;
Takumi Yamaguchi, Kyoto, JP;
Takuma Katayama, Kyoto, JP;
Mitsuyoshi Mori, Kyoto, JP;
Keisuke Tanaka, Osaka, JP;
Takumi Yamaguchi, Kyoto, JP;
Takuma Katayama, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A first semiconductor chip includes a fixed electrode formed on a first semiconductor substrate and a plurality of first metal spacers formed on a first interlayer dielectric. A second semiconductor chip includes a vibrating electrode formed on a second semiconductor substrate and a plurality of second metal spacers formed on a second interlayer dielectric. The first and second semiconductor chips are metallically bonded to each other using the first and second metal spacers. An air gap is formed in a region of the condenser microphone located between the first semiconductor chip and the second semiconductor chip except bonded regions of the first and second metal spacers.