The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2009

Filed:

Sep. 24, 2007
Applicants:

Szu-han HU, Osaka, JP;

Voon Yee Ho, Osaka, JP;

Hiroshi Yamazaki, Osaka, JP;

Martin John Mccaslin, Fremont, CA (US);

Inventors:

Szu-Han Hu, Osaka, JP;

Voon Yee Ho, Osaka, JP;

Hiroshi Yamazaki, Osaka, JP;

Martin John McCaslin, Fremont, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.


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