The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Oct. 06, 2006
Hiroaki Katou, Kanagawa, JP;
Hiroaki Katou, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device has a multi-layer wiring in which resistance against migration of the semiconductor device is raised to improve the yield. Semiconductor deviceincludes a first interconnect (wiring), formed in a first interlayer insulating filmon a semiconductor substrate, not shown, a viaprovided on the first interconnect (wiring)so that the via is connected to the first interconnect (wiring), and a different element containing electrically conductive film. The different element containing electrically conductive film is formed selectively on a site on the top of the first interconnect (wiring)where the first wiring is contacted with the bottom of the via. The different element containing electrically conductive film contains a metal of a main component of the first interconnect (wiring)and a different element different from the metal of the main component.