The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Dec. 13, 2004
Hubert Benzel, Pliezhausen, DE;
Frank Schaefer, Tuebingen, DE;
Simon Armbruster, Reutlingen, DE;
Gerhard Lammel, Tuebingen, DE;
Christoph Schelling, Reutlingen, DE;
Joerg Brasas, Walddorfhaeslach, DE;
Hubert Benzel, Pliezhausen, DE;
Frank Schaefer, Tuebingen, DE;
Simon Armbruster, Reutlingen, DE;
Gerhard Lammel, Tuebingen, DE;
Christoph Schelling, Reutlingen, DE;
Joerg Brasas, Walddorfhaeslach, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.