The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Oct. 30, 2006
Applicants:
Jun He, Singapore, SG;
Jun Zhao, Shanghai, CN;
Ming LI Tan, Singapore, SG;
Inventors:
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 7/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A micromachined strain gauge comprising a plastically deformable piezoresistive microstructure formed on a surface of a substrate so that deformation of the substrate plastically deforms the microstructure to thereby change the resistance of the microstructure. The stress in the substrate can be determined from the change in the resistance of the microstructure.
He, Jun. (2009). Method of determining stress (U.S. Patent No. 7568396). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7568396
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile