The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7567087 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 28, 2009

Filed:

Aug. 16, 2005
Applicants:

Tohru Yamakami, Shinagawa, JP;

Takahiro Kondou, Shinagawa, JP;

Inventors:

Tohru Yamakami, Shinagawa, JP;

Takahiro Kondou, Shinagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An evaluation board having an interconnection line pattern formed thereon is disclosed. The interconnection line pattern has a first end to be connected to a cable assembly and a second end to be connected to a measurement device measuring the transmission characteristic of the cable assembly. The evaluation board includes an equalizer circuit equalizing the transmission characteristic of the cable assembly.


Find Patent Forward Citations

Yamakami, Tohru. (2009). Evaluation board and cable assembly evaluation method (U.S. Patent No. 7567087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7567087

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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